| 摘要 |
<p>PURPOSE:To improve the yield of bonding at the time of assembly, and to increase resistance to part corrosion due to moisture intruding along a wire by constituting a pad for electrical measurement electrically connected to a pad for wire bonding while being formed on the surface of a wafer. CONSTITUTION:One sides of the size of pads 11 for bonding on a semiconductor chip 10 are formed in approximately 100mum, and one sides of the size of pads 12 for electrical measurement on a wafer are formed in approximately 50mum. The width of inter-pad wirings 13 for connecting the bonding pads 11 and the measuring pads 12 are shaped in approximately 10mum. All of these conductor layers 11, 12, 13 are formed of aluminum. In the constitution of such a semiconductor chip, electrical measurement on the wafer is conducted by using the pads 12 for measurement including the measurement of redundancy times, and wire bonding is performed by employing the pads 11 for bonding. Accordingly, each pad is attacked once respectively.</p> |
