| 摘要 |
PURPOSE:To make it possible to remove flash burr without involving damage on a lead frame or a resin mold section by inserting the lead frame, and carrying out electrolytic processing with the lead frame as a cathode after having molded a hollow sealing member once, and then injecting high pressure water thereto. CONSTITUTION:A hollow sealing member 1 uses a lead frame 2 and thermosetting resin and it is molded into one piece based on injection molding or transfer molding where the lead frame 2 is inserted, thereby forming a one piece hollow sealing member. During the molding, flash 3 is generated at an outer lead 2a of the lead frame and at the corners of the resin hollow sealing member of an inner lead section 2b. Electrolytic processing is carried out with the lead frame 2 as a cathode and the flash is completely removed by injecting high pressure water. A semiconductor device 4 is mounted on an island 2c of the lead frame. After the lead frame is connected with the semiconductor device with a bonding wire 5, a cover member 8 is bonded, thereby producing an air tight-semiconductor device. |
