| 摘要 |
PURPOSE:To prevent deterioration of characteristics of integrated circuit, e.g. increase of delay time, by making bores through a bonding pad and decreasing the actual area of the bonding pad thereby decreasing the capacitance between the bonding pad and a semiconductor substrate. CONSTITUTION:At first, individual elements 5 and an insulating film 6 are formed followed by formation of an aluminum fib 12. Aluminum wirings 3, 4 and bonding pads 10, 11 having multiple bores are then fanned simultaneously by the use of a photomask 13. Lead wires 8, 9, e.g. gold wires, are finally bonded to the bonding pads 10, 11 having bores thus producing a semiconductor integrated circuit. According to the constitution, capacitance between the bonding pad and the semiconductor substrate is decreased resulting in prevention of deterioration of characteristic due to stray capacitance. |
