| 摘要 |
PURPOSE:To improve light incident efficiency to an optical fiber by vertically arranging an optical fiber which is cut obliquely from part or whole of a bottom on the surface of a light emitting chip, and integrally molding them with resin. CONSTITUTION:A chip 1 of a semiconductor light emitting element is secured to the recess of the surface of a reflecting concave mirror 1, and connected to electrodes 3, 4 with leads 5. Then, the whole body is sealed with transparent resin 6 while leading the electrodes 3, 4 to the outside, and an optical fiber 7 which has substantially the same sectional area as the chip 1 is buried in the resin 6 oppositely to the chip 1. In this configuration, the surface of the fiber 7 which is opposed to the chip 1 is partly or entirely cut obliquely. When the fiber 7 is buried, the short side at the cut side is disposed at the side of leads 5, and the long side is made to approach to contact the surface of the chip 1. Accordingly, the light incident efficiency of the light from the chip 1 to the fiber 7 is remarkably improved as compared with an optical fiber which has a flat end face. |
