| 摘要 |
PURPOSE:To make it possible to manufacture a solar cell board at low cost and with ease by using a heat resisting mold whose surface is coated with boron nitride about the manufacturing method of a solar cell which charges silicon powder into the heat resisting mold, heat-melting the silicon powder, and manufactures the solar cell board. CONSTITUTION:A proper amount of Si powder is set into a recessed part of a mold 1 where a cover 2 is placed on the mold. The recessed part of the mold 1 is cut at a depth from 0.2 to 1mm. The depth of cut is capable of controlling the thickness of a Si board to be formed. Then, the surface between the mold 1 and the cover 2 is coated with boron nitride. The mold into which Si powder is charged, is set to a furnace where the whole mold is heated at a temperature which exceeds the melting point of silicon. After the Si is melted, the temperature is lowered so that the Si may be solidified. When BN is used as a parting agent, the BN applied for the coating is not fused to the Si. Therefore, it is unnecessary to coat every time so that the mold may be used repeatedly. The molten Si does not react with the mold, which makes it possible to part the Si from the mold easily. |
