| 摘要 |
PURPOSE:To execute a hardening operation in a short time by adopting an electron-beam hardening resin (EB-curing) silver paste. CONSTITUTION:A silver foil is pasted on one face of a flexible resin insulating film 1; it is patterned to be a desired pattern; and a conductive passage 3 is formed. Then, an EB-curing silver paste 3 is applied to the conductive passage 2 by a screenprinting operation or the like. In addition, a semiconductor element 4 is die-bonded to the paste 3. In addition, a metal sheet 7 of aluminum is brought into contact with the rear side; the paste 3 is irradiated with an electron beam 6 from the side of the semiconductor element 4; and the paste 3 is hardened. When the paste 3 is irradiated with the electron beam, it starts to harden. At this time, the electron beam heats the sheet 7. The heat is applied also to the paste 3 from the side of the insulating film 1; and a stress strain by which the paste 3 is shrunk in its central direction when it is hardened rapidly is annealed and relaxed. |
