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发明名称
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING
摘要
申请公布号
JPH0480225(A)
申请公布日期
1992.03.13
申请号
JP19900190610
申请日期
1990.07.20
申请人
SUMITOMO BAKELITE CO LTD
发明人
ODA SHIGERU
分类号
C08G59/62;C08G59/00;C08G59/14;C08K3/00;C08L63/00;H01L23/29;H01L23/31
主分类号
C08G59/62
代理机构
代理人
主权项
地址
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