FUNCTIONAL AT SPEED TEST SYSTEM FOR INTEGRATED CIRCUITS ON UNDICED WAFERS

摘要

2091442 9204637 PCTABS00011 A digital test system for functionally testing undiced, diced, and packaged ICs on wafers at relatively high test frequencies. The primary components of the system (20) include an interface assembly (22); a high frequency probe card assembly (24); a test signal generator (26) for generating input signals (28) which are applied through the interface assembly (22) and the probe card assembly (24) to an IC die undergoing test; a response signal analyzer (34) for analyzing response signals (36) that have been supplied in response to the input signals (28) and conducted through the probe card assembly (24) and the interface assembly (22); a clock (38) for supplying clock signals (40) which control the operation of the interface assembly (22) and the probe card (24) and synchronize the relative timing of the delivery of the input signals (28) and the receipt of the response signals (36); a wafer prober (42) for positioning the IC wafer being tested; a power supply (50); and a control computer (44).