发明名称 SOLDERING DEVICE UNDER VAPOR
摘要 PURPOSE:To restrain the consumption of a liquid to the minimum by arranging a cooling coil to the soldering chamber generating a vapor and the inlet port and outlet port carrier pipes carrying a part in and out, further arranging a partition plate to the inner part of each carrier pipe and preventing the flow-out of a vapor. CONSTITUTION:The part 19 carried into a soldering chamber 14 via an inlet port carrier pipe 21 from a conveyor 20 is carried out via an outlet port carrier pipe 22 after soldering under the vapor 17 generated by heating a liquid 15 by a heater 16. The vapor 17 is cooled by arranging cooling coils 18, 23a, 23b in the soldering chamber 14 and carrier pipes 21, 22, the formed liquid 15 is collected to a storage tank 46 via the holes 40-45 for piping, the level is detected by a sensor 47 and it is returned to the soldering chamber 14 by actuating a pump 48. In this case the runoff of the vapor is prevented by providing plural partition plates 24-31 at the inner part of the carrier pipes 21, 22.
申请公布号 JPS62263863(A) 申请公布日期 1987.11.16
申请号 JP19860107065 申请日期 1986.05.09
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TAKAHASHI MASARU;SAITO SUSUMU;NAITO TAKAO;MISAWA YOSHIHIKO
分类号 B23K1/015;H05K3/34 主分类号 B23K1/015
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