发明名称 |
METHOD FOR PROCESSING PLASTIC PACKAGED ELECTRONIC DEVICES |
摘要 |
METHOD FOR PROCESSING PLASTIC PACKAGED EKECTRONIC DEVICES The subject invention is a method for processing a plastic packaged electronic device with soldered leads. The solder has a critical temperature which if exceeded more than once results in its oxidation. The method comprises protecting the device with a carrier, and baking the device and carrier in a low pressure environment and at a temperature sufficiently high enough to drive off moisture previously absorbed by the plastic but lower than the critical temperature of the solder. |
申请公布号 |
CA1297209(C) |
申请公布日期 |
1992.03.10 |
申请号 |
CA19890612259 |
申请日期 |
1989.09.21 |
申请人 |
NCR CORPORATION |
发明人 |
ELLIOTT, BLAINE K.;BRIGGS, DUANE A. |
分类号 |
H01L21/56;H05K3/34 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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