| 摘要 |
PURPOSE:To reduce the number of production steps and improve productivity by forming connection terminals on the inside wall of a case, placing a capacitor with external electrodes inside the case so that the external electrodes and the connection terminals are in contact, and creating an electric connection between the connection terminals and external electrodes by electromagnetic induction heating. CONSTITUTION:A capacitor 3 is placed inside a covered case 2 which has the connection terminals 6. The external electrodes 5 on both sides of the capacitor 3 are inserted against the slanted surfaces of the inner walls 2a and 2b. This ensures that the external electrodes 5 and the connection terminals 6 are securely in contact. Next, multiple covered cases 2 carrying capacitor 3 are placed in an electromagnetic induction heater and electromagnetic induction heating is performed. As a result, the Ni second layer of the connection terminals 6 give off heat and the Sn-Pb of the external electrodes 5 and the Sn-Pb third layer of the connection terminals melt together to form a connection. A sealant resin 7 is then added into the case 2 to resin seal the condenser 3. A chip capacitor is produced by this process. |
