| 摘要 |
PURPOSE:To improve the reliability of connection by positioning the leads of a surface packaging connector to the circuit patterns on both surfaces of a printed circuit board, supplying a proper amt. of solder paste by a dispensing nozzle to the contact parts of the leads and the patterns and melting the solder paste by heating. CONSTITUTION:The circuit patterns 3, 3 on both surfaces of the printed circuit board are crimped by a pair of the forked leads 1, 1 of the surface packaging connector 2 and the leads 1 are positioned relative to the circuit patterns 3. The proper amt. of the solder paste is supplied to the contact parts of the leads 1 and the circuit patterns 3 by using the dispensing nozzle 5. The solder paste 6 is then melted by heating to solder the leads 1 and the circuit patterns 3. The connection of the surface packaging connector 2 onto the printed circuit board by soldering is executed by the dispensing supply of the solder in this way and, therefore, the soldering stage is simplified and the supply rate of the solder is stabilized to improve the reliability of the connection. |
