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发明名称
METHOD AND APPARATUS FOR FORMING SOLDER BUMP
摘要
申请公布号
JPH0473937(A)
申请公布日期
1992.03.09
申请号
JP19900186774
申请日期
1990.07.13
申请人
HITACHI LTD
发明人
FUKAZAWA HIDEYUKI;HASEGAWA HIROSHI;ODAJIMA HITOSHI;KAWARADA MASAYUKI
分类号
H01L21/60;H01L21/321
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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