发明名称 SOLDER REFLOWING DEVICE
摘要 PURPOSE:To prevent warpage of a board by holding the lower surface of the board at a predetermined height by backup pins. CONSTITUTION:The lengths of first, second preheating chambers 4, 5, a reflow heating chamber 6 and a cooling chamber 8 are made equal, a conveying chain conveyor 12 is intermittently operated, and boards 15 are respectively stopped at the centers of the chambers. A conveyor for conveying dropped boards is removed, and pin mounting plates 18 mounted with a plurality of backup pins 17 vertically moved by actuators 16 are provided directly under stopping points. When the conveyed boards 15 are respectively stopped at the centers of the chambers, the actuators 16 are operated, and the pins 17 of the plates 18 flatly support the stopped boards 15. Accordingly, even if the boards 15 are softened by heating, they are not warped.
申请公布号 JPH0472693(A) 申请公布日期 1992.03.06
申请号 JP19900171373 申请日期 1990.06.30
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TANIGUCHI MASAHIRO;KAMETANI YASUHIRO;YANAIKE SEISHIROU
分类号 B23K1/008;B23K3/00;B23K31/02;B23K101/42;F27B9/24;F27B9/36;F27B9/40;H05K3/34 主分类号 B23K1/008
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