| 摘要 |
PURPOSE:To carry out cooling from middle layers positively after relaxing the mutual heat effect between middle layers by stacking multichip semiconductor device, on a board which are connected electrically to the leads of film carrier tapes and have connectors on which heat sinks are mounted. CONSTITUTION:A TAB method semiconductor chip, which is provided with a heat sink being punched out of a TAB tape reel, is electrically connected by solder to the electric connection called pattern 12 on a connector by means of a lead 3. After this, the heat sink 5 is faired by the processing similar to the lead forming of an SOP package to make package structure. Using such a heat sink, one can promote the heat radiation from chip surface to air effectively by the metal excellent in thermal conductivity. The heat generated is conducted out of the laminated multichip semiconductor device positively by the work of the heat sink installed on the semiconductor chip of each layer. Then it is discharged to outside air, so especially in the middle layer, it is cooled surely as compared with the case that it has not heat radiating structure. |
