| 摘要 |
<p>PURPOSE:To obtain a multilayer board having the forms of various circuits by a method wherein an anisotropic conductive film is installed between first and second substrates along with an arbitrary circuit component and the electrical connection of the electrodes of the circuit component with wiring conductors, which are respectively formed on the first and second electrodes, is selectively performed through the anisotropic conductive film. CONSTITUTION:A multilayer board is constituted between first and second substrates 2A and 2B and an anisotropic conductive film 10 containing a conductive filler 14 is inserted between electrodes 61, 62, 63...6n of a base chip 6 and wiring electrodes 21, 22, 23...2n. Then, wiring conductors 20a and 20b are respectively formed on the substrates 2A and 2B and an anisotropic conductive bonding agent 12 is inserted between the conductors 20a and 20b to form a multilayer structure. In this case, the conductors 20a and 20b are in a state that they are insulated from each other via the film 10. There, when a pressure F is applied between the substrates 2A and 2B to compress the bonding agent 12, heat is applied and the compressed state of the agent 12 is fixed, connecting pieces are constituted of the filler 14 contained in this agent 12 and conductor circuits are formed between the substrates 2A and 2B. Thereby, the connection between the built-in component and the wiring conductors 20a and 20b can selectively be made possible.</p> |
