| 摘要 |
PURPOSE:To increase the mounting capacity of a chip by increasing the area of a chip mounting part and preventing the chip edge from touching the lead wire. CONSTITUTION:A chip mounting part 11 and the edge of a lead drawing electrode 12 are permitted to be on the same cross section 18 and the chip mounting plane of the chip mounting part 11 and the plane of the lead drawing electrode 12 are not on the same side plane and are deviated vertically. Thus, the area of the chip mounting part 11 becomes wide, a gap 17 between a wire 15 and the chip 14 becomes large since the chip mounting plane is deviated downward from the plane of the electrode 12, the wire 15 and the edge of the chip 14 do not touch each other and the length of the wire 15 is shortened.
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