| 摘要 |
PURPOSE:To increase an adhesion between an outer lead and a coated wire while keeping the temperature at the chip side lower than the circuit destruction temperature by joining the coated wire to a second bonding section at the outer lead side by thermocompression or by thermocompression together with ultrasonic waves with the second bonding section heated to higher temperature than a first bonding section at the Chip side. CONSTITUTION:Betweem a bonding stage B and the central part A1 of a lead frame on which a chip 1 is mounted, a heat stage 4a is installed which is almost the same size with the chip 1. Apart from the heat stage 4a at the chip 1 side, another heat stages 4b are installed between the bonding stage B and the outer part A2 of the lead frame on which outer leads 2 are formed. On the upper surface of the chip 1, electrodes 1a and first bonding sections 1b where one end of coated wire 3 are joined by ball bonding using a capillary are formed. The outer lead 2 is made of Cu, Fe or other material which is plated with Ag, Al, etc. On the upper surface of each outer lead 2, a second bonding section 2a is formed where the other end of the coated wire 3 is joined by thermocompression wire bonding or by thermocompression wire bonding together with ultrasonic waves. |
