| 摘要 |
The wire saw has cutting wires (4) which are driven in one direction, or alternately, and are supported (9) against the component (2) to be sawn. Vibrations induced from a vibration generator (10) assists in distributing abrasive mixture and wire penetration. The vibration generator is intergrated with the cutting machine (8) and may operate through the abrasive applicator (3). Alternatively, the vibration generator operates by contact with either component or cutting wires, possibly at abrasive applicator level. The vibration generator, or generators, may be piezo electric, mechanical, pneumatic or profiled surface wire guide (1). USE/ADVANTAGE - Wire saw, cutting high cost materials for the electronics industry, e.g. ferrite, quartz, silicon, ceramic, etc., is more efficient, with less waste than diamond discs.
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