SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PURPOSE:To facilitate height adjustment and accomplish excellent flatness without deformation after molding by permitting a lead to fit by resin sealing in order to form a recessed part which permits the lead in turnable shape as sphere to fit. CONSTITUTION:On the top plane of a jig 6, plural fixing recessed parts 9 are arranged in grid and turnable sphere-shaped leads 3 are fit and mounted on the recessed parts 9. A lead frame 4 is positioned by guide pins 7a-7d and is mounted on fixing projecting parts 8a-8d and the lead 3. Holes 10 are formed on each of the projecting parts 8a-8d and the recessed part 9. The lead frame 4 and the lead 3 are firmly fixed by adsorption using a vacuum pump 11 and the lead 3 is firmly fixed by welding by applying laser beams 12 from the surface of the part where the lead 3 is made to abut on the lead frame 4. The lead frame 4 is positioned and set in dies 13 composed of a cope 13a and a drag 13b by guide pins 14a-14d, resin is injected from the inlets 1 and 6 of the cope and a package is completed after hardened.