| 摘要 |
PURPOSE:To greatly simplify steps by laminating and adhering a plurality of both-side printed circuit boards in which through hole plating is previously conducted by using adhesive, and through hole-connecting the conductors of the layers by electrolessly plating. CONSTITUTION:Since a plurality of both-side prepregs in which through hole plating is previously conducted are laminated and adhered with adhesive 4 except through hole 9 and the periphery of the hole, the adhesive is adhered to the inner wall of the hole 9. So-called a smear phenomenon does not occur. Since the interior of the hole 9 is copper-plated 5 at a printed circuit board and provided only with thin adhesive, it is not necessary to adhere plating catalyst. Accordingly, since no smear occurs and catalyst adhering is not required, steps of plating and catalyst-adhering can be eliminated. |
