Prodn. of resist patterns on substrates, esp. drilled substrates - by laminating substrate with a solid resist, removing the protective film, applying a liq. resist, exposing with a mask, and developing

摘要

Process comprises (a) laminating the substrate with a solid resist (A); (b) removing the protective film from (A), (c) applying a liq. resist (B) to (A), (d) exposing the photopolymerisable layer consisting of (A) and (B), with an exposure mask applied directly to the photopolymerisable layer, and (e) developing the exposed layer. (B) is applied by spin-coating, after which the combination is dried and cooled. USE/ADVANTAGE - The process enables the prodn. of resist patterns with a fine structure on substrates with drill holes (i.e. for the prodn. of printed circuits) without building up lacquer round the drill holes or covering the holes themselves (contrast prior-art processes).