| 摘要 |
PURPOSE:To enable the formation of a metallized layer having a high adhesive strength and reliability and at a low baking temperature by coating the surface of an aluminum nitride substrate with a high-melting metallic paste, heating and burning the applied metallic paste. CONSTITUTION:An aluminum nitride substrate composed of either of a formed aluminum nitride product preformed so as to have a prescribed shape and a sintered aluminum nitride is prepared. A high-melting metallic paste, containing 1-40wt.% one or more oxides of Al2O3, SiO2, CaO and Y2O3, 0.01-1.0wt.% one or more iron family elements and high-melting metals composed of W and Mo at (1/1)-(1000/1) weight ratio of the M to Mo is prepared. The surface of the aforementioned aluminum nitride substrate is then coated with the above- mentioned high-melting paste. The resultant aluminum nitride substrate coated with the aforementioned high-melting metallic paste is subsequently heated and burned at 1400-2000 deg.C temperature. Thereby, the objective metallized layer can be formed on the surface of the aluminum nitride substrate. |
