| 摘要 |
PURPOSE:To enable adhesion strength of wire bonding to be improved and scattering of the adhesion strength to be reduced by further striking at least near a second bond of the second bonded wire in connection by wire bond. CONSTITUTION:A wire 36 is used to connect an electrode part 33 of a bare chip IC 32 which is mounted on a circuit board 31 and an electrode part 37 which is provided on a wiring 35 near the bare IC chip 32. Then, a wire ball which is formed on the wire which jumped from a tip of a capillary due to electrical discharge is welded on the wire near a second bond neck part of the wire 36 which is thus connected by using pressure which is applied to the capillary and ultrasonic energy in piles and the wire is pulled out by pulling up the capillary, thus forming a ball 39. A lower surface periphery of the struck ball 39 in tiles in this manner is firmly welded onto a surface of the electrode part 37 of the wire 35 which also holds down the wire 36 which is connected initially, thus enabling welding strength to be reinforced. |
