Wiring structures and method of manufacturing the same

摘要

The present invention provides the wiring structure having a wiring layer and insulation layer and the method of manufacturing the same, wherein at least a part of the wiring of said wiring layer comprises copper, and said insulation layer comprises the polyimide obtained by heating the polyimide precursor composition containing the polyimide precursor having the repeating unit which can be represented by the following general formula (Chemical formula 15). <IMAGE> (Chemical formula 15) <IMAGE> (Chemical formulae 16) <IMAGE> <IMAGE> type of quadrivalent organic group selected from among the Chemical formulae 16, while R2 is a bivalent organic group containing aromatic ring).