| 摘要 |
PURPOSE:To contrive to generate hardly a warpage in the title board and to contrive the improvement of the thermal shock resistance of the board by a method wherein a conductive cementing material consists of a conductive paste containing a resin composition as a binder and/or a solder material and an insulative bonding agent is constituted of an organic bonding agent. CONSTITUTION:With an organic bonding agent 4 consisting of an SiO2 particle- containing thermosetting epoxy resin composition applied on the surface of a ceramic substrate 1' except parts 2'a for intersubstrate continuity use of a circuit 2' on the surface of the substrate 1' by a screen printing method, a conductive paste 5 containing a resin composition as a binder is applied on the parts 2'a as a conductive cementing material using a dispenser. A ceramic substrate 1 is superposed on the substrate 1' in such a way that parts 2a for intersubstrate continuity use face the parts 2'a via the paste 5 and the substrates 1 and 1' are pressed and heated. Whereupon, the bonding agent 4 and the paste 5 are hardened, the parts 2a and 2'a are jointed to each other and a multilayer ceramic circuit board is completed. A prescribed interval is held between the ceramic substrates 1 and 1' SiO2 particles and short circuit between a circuit 2 on the surface of the substrate 1 and the circuit 2' is reliably prevented. |
