发明名称 CONNECTION STRUCTURE OF ELECTRODE TERMINAL AND WIRING OF SUBSTRATE
摘要 PURPOSE:To stably connect an electrode terminal to a wiring even if both are provided in high density by providing a clip of shape memory alloy or shape memory resin for holding a board and a flexible circuit board to bring both in pressure contact, and an expansion/contraction preventive member having smaller thermal expansion coefficient than that of the circuit board. CONSTITUTION:Since an expansion/contraction preventive member 50 having smaller thermal expansion coefficient that that of a flexible circuit board 40 is adhered to the end of the board 40 connected to the terminal 21 of an elec trode board 20, even if the circuit board tends to expand or contract due to a decrease in the ambient temperature, the member 50 having smallr thermal expansion coefficient than that of the board 40 suppresses the expansion/ contraction of the board 40. Thus, when the expansion/contraction of the board 40 due to temperature change is suppressed by adhering the member 50, position al deviation of the terminal 21 on the board 20 to wirings 41 of the board 40 due to temperature change can be suppressed. Thus, positional deviation of the wiring of the board to the terminal electrode of the board is prevented, and both can be stably connected.
申请公布号 JPH0444288(A) 申请公布日期 1992.02.14
申请号 JP19900150878 申请日期 1990.06.07
申请人 SHARP CORP 发明人 SUGIMOTO SHINICHI;KAWAGUCHI HISAO;HASHIMOTO HARUO
分类号 H05K1/14;H05K1/02;H05K3/36 主分类号 H05K1/14
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