发明名称 Wafer wet processing device
摘要 A wafer wet processing device which comprises a processing container containing side walls; means for introducing a processing solution to the lower portion of said container; means for removing the processing solution from the upper portion of said container; and a wafer carrier containing side walls and being open at the top and bottom thereof, said wafer carrier being slidably disposed within said processing chamber, wherein at least the lower portion of the side walls of said processing container is contiguous with the lower portion of the side walls of said wafer carrier so that the entirety of the processing solution is introduced within the wafer carrier.
申请公布号 US5845663(A) 申请公布日期 1998.12.08
申请号 US19970803640 申请日期 1997.02.21
申请人 LG SEMICON CO., LTD. 发明人 HAN, SUK-BIN
分类号 H01L21/306;B08B3/10;B08B11/02;H01L21/00;H01L21/30;H01L21/304;(IPC1-7):B08B3/04 主分类号 H01L21/306
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