| 摘要 |
A multilayered substrate for printed circuit boards of electrical circuits, said substrate consisting of copper and ceramic layers which are joined together by the DBC method into said multilayered substrate, with each copper layer being formed by a copper sheet and each ceramic layer being formed by a ceramic plate, at least two of said layers forming a layer sequence having a hollow section or core, said at least two layers being arranged essentially parallel to each other, said at least two layers being spaced apart from one another by an intermediate spacing layer.
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