发明名称 Isopropanol catalyst for copper chemical vapor deposition
摘要 An alcohol having an alpha hydrogen with the remaining groupings attached to the carbon atom being either hydrogen or an alkyl group having from 1 to 5 carbon atoms, preferably isopropanol, is added to the flow stream of a copper chelate gas, preferably a copper diketonate, the copper diketonate preferably being Cu(hfac)2 or a composition identical thereto wherein one or more of the fluorine atoms is replaced by one of hydrogen atoms, and alkyl group having from one to five carbon atoms and a gas, preferably a reducing agent, preferably hydrogen. As a second embodiment, some or all of the copper can be replaced by aluminum to provide either Al(hfac)3 or a combination of Cu(hfac)2 and Al(hfac)3. While the flow rates of each of the components is not critical and will vary with materials used and conditions, a flow rate for the reducing agent of from about 15 to about 60 SCCM and preferably 20 SCCM is appropriate with the amount of alcohol and metal chelate entering the flow stream being determined by the vapor pressure of the material involved. The flow stream enters as standard CVD reactor wherein the sample to be coated with copper is heated, thereby causing the copper to be deposited only on the heated area. The other reaction products are gaseous and are removed from the reactor by means of a pump or the like as is well known.
申请公布号 US5087485(A) 申请公布日期 1992.02.11
申请号 US19900567491 申请日期 1990.08.14
申请人 TEXAS INSTRUMENTS INCORPORATED 发明人 CHO, CHIH-CHEN
分类号 C23C16/18;C23C16/20 主分类号 C23C16/18
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