发明名称 MULTILAYER PRINTED BOARD
摘要 PURPOSE:To obtain a general-purpose multilayer printed board by providing a conductor pattern for forming a predetermined repetitive continuous pattern substantially in an entire conductor pattern layer in which insulator sides are bonded to both sides. CONSTITUTION:Conductor foils to become conductor patterns 6, 9 are formed to cover substantially entire surfaces of one side of an insulating board 1 and the other side of an insulating board 5, and conductor patterns 7, 8 are formed to cover an insulating board 3 in a lattice shape. The boards 1, 3, 5 are sequentially laminated and connected. The patterns 6, 9 are provided in predetermined pattern on a multilayer printed board in which the boards 1, 3, 5 are connected, through holes are formed at predetermined positions to obtain a state in which electronic components for forming various electronic circuits are mounted.
申请公布号 JPH0439991(A) 申请公布日期 1992.02.10
申请号 JP19900147100 申请日期 1990.06.05
申请人 SONY CORP 发明人 NUMAO TAKAYOSHI
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址