| 摘要 |
PURPOSE:To form a conductor pattern between internal layer patterns, whose exposed layers are different from each other and which have a step, by a simple operation and to connect electrically the internal layer patterns to each other by a method wherein a conductive paste is applied on the main surface of a roller, whose main surface is molded in such a way that it is formed into a curved surface conforming to the shapes of the recessed surfaces of the internal layer pattern regions, which are connected to each other, of a multilayer printed wiring board and which consists of an elastic material, into a desired pattern shape and thereafter, the main surface of the roller is pressure-welded on the recessed surface of the multilayer printed wiring board and the conductive paste pattern is transferred lying across between the exposed internal layer patterns. CONSTITUTION:Desired conductor patterns are printed and formed using a silver or copper conductive paste 5 on the main surface of a roller 4, which consists of silicone rubber and has a half-round section. Then, the silicone rubber roller 4 is pressure-welded on the recessed surface of a multilayer printed wiring board 1 by a proper pressure and the conductor patterns formed by applying the paste 5 are respectively transferred lying across between patterns 2 and 3 and between the pattern 3. Nickel-gold electroplating layers 6 are applied and formed on the transferred conductor patterns consisting of the paste 5, the external layer conductor pattern 2 and the exposed internal layer conductor patterns 3 and thereafter, unnecessary plated parts are removed except plated parts on the pattern 2 and the exposed patterns 3. |
