发明名称 HIGH POWER HYBRID INTEGRATED CIRCUIT DEVICE
摘要 PURPOSE:To ensure high integration by deriving a small signal lead terminal from one substrate without allowing the terminal to protrude from a substrate surface, and extending a power lead terminal fixed onto the other substrate along a casing and disposing a connection part between the terminal and the casing such that said connection part is substantially flush with the exposed surface of the one substrate. CONSTITUTION:A small signal lead terminals 3a for connection to external circuits is fixedly mounted on a pad 6a provided on the opposing peripheral edges of a substrate 1a. The lead terminal 3a alows its tip end to be disposed, directed upwardly from a horizontal direction and not to be protruded from an exposed surface of the one substrate 1a. A power thick conductor passage 5b is primarily formed on the substrate 1b. A plurality of puds 6b for fixing the power lead terminal are provided on one peripheral edge side of the substrate 1b extended from the conductor passage 5b, on which pads 6b power lead terminals 3b are fixed. Further, not only the power conductor line 5b but also a conductor passage of part of a signal system are formed on the other substrate 1b.
申请公布号 JPH0430564(A) 申请公布日期 1992.02.03
申请号 JP19900138747 申请日期 1990.05.28
申请人 SANYO ELECTRIC CO LTD 发明人 SAITO HIDESHI;SHIMIZU HISASHI;OTA SUSUMU
分类号 H01L25/07;H01L25/18 主分类号 H01L25/07
代理机构 代理人
主权项
地址