发明名称 SOLDERING INSPECTING METHOD
摘要 PURPOSE:To enable easy inspection by irradiating the surface of a soldering part in different directions and picking up its images, finding illuminance representative points from the sum of all illuminance distributions of the surface by two electric conversion images, and deciding the movement direction and quantity between both the images. CONSTITUTION:The soldering part 2 is positioned on the optical axis of a camera 6, irradiated by a light source 5a, and picked up by a camera 6, one frame image is stored in an image memory 8, and then a light source 5b is used to perform similar operation. Bright points Ra and Rb are formed on the surface of the soldering part 2 by both the irradiating operations and move by the switching process of the light sources 5a and 5b, the movement quantity corresponds to the curvature of the surface shape of the soldering part 2, i.e. the amount of solder. Then both the image are read out of the memory 8 and their picture elements are scanned in order to find the centers G of gravity from the sums of X- and Y-directional illuminance distributions; and the movement direction and quantity between both the centers G of gravity are found to find the uneven shape of the soldering part 2 from the former and the amount of solder from the latter, and they are compared with ideal data which are inputted previously to decide whether or not the inspected object is normal. Consequently, the easy inspection is performed.
申请公布号 JPH0425749(A) 申请公布日期 1992.01.29
申请号 JP19900132024 申请日期 1990.05.22
申请人 ROZEFU TEKUNOROJII:KK 发明人 YAMAMOTO TAKAHIRO;WATABE TAKEFUMI;NUMATA MUNETOSHI
分类号 G01B11/24;B23K1/00;G01N21/88;G01N21/956;G06T1/00;H05K3/34 主分类号 G01B11/24
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