| 摘要 |
PURPOSE:To improve a reliability, by providing a through hole on the tip part of an inner lead of a lead frame, and by aligning the through hole with an electrode on a semiconductor device, and by bonding the inner lead to the electrode through the through hole. CONSTITUTION:To both the surfaces of a raw material 6 of a lead frame, a photoresist 7 is applied. Thereafter, formed is the photoresist 7, in which the shape of the lead frame and the shape of a part 8 to come into a through hole are exposed to the outside, and etching is performed. Further, the photoresist 7 is peeled, and on the peripheral part of a through hole 2, plating 9 is performed. Then, the through hole 2 of an inner lead 1 of the lead frame is aligned with an electrode 4 on a semiconductor device 5, and the device 5 is heated. At the same time, a bonding wire fed from a capillary 10 is heated and molten by a torch 11, and a ball 12 is created. Then, the bonding wire is passed through the through hole 2, and the inner lead is bonded to the electrode 4. Then, the capillary 10 is drawn up, and the bonding wire 14 is cut by the torch 11, and further, a connection body 3 is formed. Thereby, a bonding time is decreased and a reduction of a cost becomes possible. |
