| 摘要 |
PURPOSE:To easily form bump electrodes by using an existing manufacturing apparatus by a method wherein a ball portion having a diameter larger than that of a wire is formed on the end of the wire exposed on the end of a capillary; it is pressed to an electrode on a board; the wire extending from the ball portion is melted off in the vicinity thereof; and a projection is formed on the ball portion. CONSTITUTION:A high voltage is applied between a wire 3 and a discharge terminal 4, causing the end of a wire 3 to be melted, and a ball portion is formed. Next, a capillary 2 is moved downward toward an electrode pad 6. A ball portion 5 is pressed while the shape thereof is being plastically changed. Thereafter, when the capillary 2 is moved upward to a predetermined height, the wire 3 extends between the pressed ball portion 5 and the capillary 2. A discharge between the wire 3 and the discharge terminal causes the wire 3 to be melted off. Then, a projection 8 is formed on the pressed ball portion, and a new ball portion 7 is formed on the capillary 2. |
