| 摘要 |
<p>PURPOSE:To enable a wafer to be accurately aligned without causing damage by a method wherein the wafer is made to come into contact with the protrudent edge of a stopper by air jet and fixed to a rotary means by a means such as vacuum suction or the like, the stopper is made to recede and the wafer is rotated, and the detection part of the wafer is detected by a photosensor. CONSTITUTION:A wafer 6 transferred onto a rotating means 20 through a transfer means is brought into contact with the protrusion 31 of a stopper 30 at a fixed position by air jet from an air jet nozzle 49 and fixed to the rotating means 20 by a means such as vacuum suction or the like. The stopper 30 is made to recede to separate the protrudent edge 31 from the wafer 6, the wafer 6 is rotated by the rotating means 20, and a detection part 10 of the wafer 6 is detected by a photosensor as the wafer 6 is kept rotating by the rotating means 20. By this setup, a wafer can be aligned without being damaged even if it is thin and formed of fragile material.</p> |
