| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiating structure for printed board which can be manufactured by one time of flow soldering and to which a large-sized heat sink can be attached by solving the problem that reflowing steps are required for separately soldering a power component and a heat sink, and no large-sized heat sink can be attached to the structure at the time of manufacturing the printed board. SOLUTION: In the heat radiating structure for printed board, the power component is flow-soldered to the soldered surface of the printed board, and the heat sink is mounted on the component-mounted surface of the printed board through an insulating sheet. Therefore, the manufacturing process of the printed board becomes simpler. COPYRIGHT: (C)2005,JPO&NCIPI |
