发明名称 THERMOPLASTIC LOW-PROFILE ADDITIVES AND USE THEREOF IN POLYESTER RESIN COMPOSITIONS
摘要 23020A - 33 THERMOPLASTIC LOW-PROFILE ADDITIVES AND USE THEREOF IN UNSATURATED POLYESTER RESIN COMPOSITIONS A low-profile additive composition is disclosed which comprises ethylene glycol, at least one nonpolar diol, adipic acid and trimellitic anhydride. The low-profile additive, when included in an unsaturated polyester resin systems, for use in making sheet molding compositions, provides improved processing characteristics such as viscosity thickening plateau, paste viscosity and phase separation during maturation when the unsaturated polyester.
申请公布号 CA2045988(A1) 申请公布日期 1992.01.24
申请号 CA19912045988 申请日期 1991.06.28
申请人 OWENS-CORNING FIBERGLAS CORPORATION 发明人 ROSS, LOUIS R.;SCHIAVONE, ROBERT J.;RAMEY, TIMOTHY W.
分类号 C08K5/10;C08G63/20;C08K5/092;C08K5/11;C08L67/06 主分类号 C08K5/10
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