| 摘要 |
PURPOSE:To enable a number of IC pieces to be soldered and obtain an outer lead bonding device which is superb in productivity by constituting a transfer mechanism and a hating mechanism separately and independently. CONSTITUTION:A transfer mechanism 16 has a slide block 21, a sucking nozzle 22 is mounted to a tip, and a heating mechanism has two heating heads 23 and two sets of heating chips 26. Then, a thin plate 40 is placed while it is in contact with an inside surface of each heating chip 26, and the sucking nozzle 22 moves toward an upper part of a center 24 of the heating heads 23 while sucking pieces 2 and then descends, thus placing the pieces 2 onto a substrate 4. Then, the heating chip 26 moves and holds an external lead wire 3 of the pieces 2 for performing soldering. And, the heating chip 26 is constantly being heated by each built-in heater and the external lead wire 3 of the pieces 2 is pressed onto the substrate 4 by the thin plate 40. However, since the thin plate 40 has an improved cooling property, solder is coagulated in a short time, thus enabling each function to be performed in parallel for reducing time and improving productivity. |
