发明名称 LASER FUSING FUSE
摘要 PURPOSE:To simplify the fusing of a fuse of a manufactured goods equipped with a multilayer interconnection by using laser, and increase yield, by forming a wiring layer so as to be insulated on a substratum, arranging a heating member between them and setting the part of the wiring layer corresponding with the upper part of the heating member as a cutting part. CONSTITUTION:On a silicon substrate 10 the following are formed in order; a field insulating film 12, a heating member 14 whose main component is silicon, an interlayer insulating film 16, and a wiring layer 18 whose main component is aluminum. The heating member 14 and a region which exists above the member 14 and contains the wiring layer 18 are made a laser fusing fuse 20. A protecting film 27 composed of a CVD silicon oxide film 22, a BPSG film 24 and a PSG film 26 and a polyimide film 28 are formed, and an aperture 30 is formed so as to correspond with the fuse 20. When the heating member 14 and the part containing the wiring layer 18 on the member 14 are irradiated with laser beam 50, the heating member 14 is heated and the wiring layer 18 also is heated. When the temperature is raised up to the fusion evaporation point, the heating member 14 generates thermal explosion, and the wiring layer 18 which is correspondently positioned above the member 14 is blown out and cut out.
申请公布号 JPH0414245(A) 申请公布日期 1992.01.20
申请号 JP19900116837 申请日期 1990.05.08
申请人 TOSHIBA CORP;TOUSHIBA MAIKURO EREKUTORONIKUSU KK 发明人 ITABA HIROAKI;KUMAGAI JUNPEI;KAKI SEIJI;USUDA YOSHIO
分类号 H01L21/82;H01L23/525 主分类号 H01L21/82
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