| 摘要 |
<p>A semiconductor package with solder balls is provided to reduce stress applied to the semiconductor package and to improve reliability by making the solder balls with materials having different thermal expansive coefficients. First solder balls(402) are arranged at the center portion of a surface of a semiconductor package(400). Second solder balls(404) surround the first solder balls. Third solder balls(406) are arranged to be corresponded to corners of the semiconductor package at remote regions of the second solder balls. The first to third solder balls have different materials. The first solder balls are arranged in one of a rectangular matrix structure, a square matrix structure, a cross structure, and a circular structure. The first to third solder balls have different thermal expansive coefficients. The thermal expansive coefficients of the first solder balls are small values and those of the third solder balls are large values.</p> |
