Electronic assembly with enhanced heat sinking.

摘要

An electronic package (10) which includes at least two flexible circuitized substrates (29) (e.g., thin film elements) connected at one location to a common first circuitized substrate (21) (e.g., printed circuit board) and at another location to a semiconductor device (27), these subassemblies being located within a base member (73) of the package. In one embodiment, a singular heat sink member (41) is thermally coupled to a respective one of the semiconductor devices (27), and a common, second heat sink member (53) is thermally coupled to all of the first heat sink members. This common heat sink member also uniquely serves as a stiffener for the package. In another embodiment, a common heat sink member is securedly positioned on the opposite side of a first circuitized substrate from the plurality of flexible circuitized substrates and semiconductor devices. A base member is also used as part of this package. As in the aforementioned other embodiment, the common heat sink member also serves as a stiffener. <IMAGE>