APPARATUS AND METHOD FOR WIREBONDING

摘要

A bonding apparatus using a wire and a boding method are provided to perform a wire bonding process by using various wires without exchanging a capillary. A first capillary(20) is installed in a bonding head(10) to discharge a first wire through a first supply hole. A second capillary(30) is installed in the bonding head to discharge a second wire through a second supply hole. An elevation unit elevates selectively the first capillary and the second capillary loaded on the bonding head. The elevation unit includes a first holder, a first drive gear, a second holder, and a second drive gear. The first holder holds the first capillary and includes a first rack gear formed in a vertical direction to an outer circumference thereof. The first drive gear is fixed to the bonding head and includes a gear coupled with the first rack gear. The second holder holds the second capillary and includes a second rack gear formed in a vertical direction to an outer circumference thereof. A second drive gear is fixed to the bonding head and includes a gear coupled with the second rack gear.