发明名称 ACTIVATED PASTE FOR ELECTROLESS PLATING AND FORMATION OF ELECTRODE USING THE SAME
摘要 PURPOSE:To form a metal electrode on a ceramic substrate plate at a low cost by using an activated paste for electroless plating consisting of a compound or a fine powder of a specific metal, a photosensitive high molecular resin, a photosensitive agent and a solvent. CONSTITUTION:In forming an electrode on a ceramic electronic parts by electroless plating, an activated paste for electroless plating prepared by mixing 0.01-10% one ore more of a fine powder or a compound of a metal selected from a noble metal such as Pd, Pt, Ag, Au or the like and a base metal such as Ni, Co, Fe, Cu, Zn or the like as the metal, 2-35% photosensitive high molecular resin such as polyvinyl alcohol or the like, 0.05-1% photosensitive agent such as ammonium bichromate or the like and 70-99% solvent such as alcohol or the like is used. This paste is coated on a ceramic substrate plate, exposed to ultraviolet irradiation and developed and, thereafter, heated at 350-900 deg.C to precipitate a metal particle on said ceramic and, further, electroless plating is applied to form a metal electrode.
申请公布号 JPS5739166(A) 申请公布日期 1982.03.04
申请号 JP19800115248 申请日期 1980.08.20
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HONJIYOU KATSUHIKO;TAGI HIROMITSU;SATOU NORIYA;OGAWA MAKOTO
分类号 H01C1/14;C23C18/18;H01C7/00;H01G4/008;H01G4/012;H01G4/12;H01L21/288;H01L41/22 主分类号 H01C1/14
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