发明名称 ELECTRONIC CIRCUIT COMPOSED OF SUB-CIRCUITS AND METHOD FOR PRODUCING THE SAME
摘要 The invention relates to an electronic circuit. In order to improve manufacture thereof, the electronic circuit is composed of modules of sub-circuits that are arranged on a common substrate, such as a cooling body, and that are electrically interconnected by means of a planar electrical contact element.
申请公布号 WO2009043670(A3) 申请公布日期 2009.06.18
申请号 WO2008EP61599 申请日期 2008.09.03
申请人 SIEMENS AKTIENGESELLSCHAFT;BIRNER, MARTIN;KREUTZER, RAINER;SCHIERLING, HUBERT;SELIGER, NORBERT 发明人 BIRNER, MARTIN;KREUTZER, RAINER;SCHIERLING, HUBERT;SELIGER, NORBERT
分类号 H01L25/065;H01L23/373;H01L23/538 主分类号 H01L25/065
代理机构 代理人
主权项
地址
您可能感兴趣的专利