| 摘要 |
PURPOSE:To enable die bonding operation simply while preventing the crack and peeling of a semiconductor chip by coating the rear of the semiconductor chip with a thermal-stress absorbing film. CONSTITUTION:The rear of a semiconductor chip 1 is coated with a polymer film 2 as a thermal-stress absorbing film through a surface active film 8, the surface active film 8 is formed because of the small wettability of the polymer with silicon, and the rear of the semiconductor chip 1 is activated and the adhesive force between the semiconductor chip 1 and the polymer film 2 is increased. An electrode formed on the surface of the semiconductor chip 1 is connected electrically to leads 6 positioned around a die pad 4 by gold wires 5, and the semiconductor chip 1 and the peripheries of electrical connecting sections are sealed with a resin 7. Accordingly, even when the adhesive force between the thermal-stress absorbing film 8 and a silver paste agent 3 and the adhesive force between the silver paste agent 3 and the die pad 4 are strong, thermal stress does not exist in the semiconductor chip 1 because thermal stress is absorbed by the elastic deformation of the polymer film 2, thus improving productivity while preventing the crack and peeling of the semiconductor chip due to thermal stress. |
