| 发明名称 |
GROUNDING AN ULTRA HIGH DENSITY PAD ARRAY CHIP CARRIER |
| 摘要 |
A die pad (108) with a punched hole providing a throughway (110) is affixed upon the chip carrier base 100. Such throughway permits the electronic interconnection of the die backside (112) to a conductive runner (104) by electrically conductive material (110) set between the die backside (112) and the conductive runner (104).
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| 申请公布号 |
US5077633(A) |
申请公布日期 |
1991.12.31 |
| 申请号 |
US19890345280 |
申请日期 |
1989.05.01 |
| 申请人 |
MOTOROLA INC. |
发明人 |
FREYMAN, BRUCE J.;MILES, BARRY M.;JUSKEY, FRANK J. |
| 分类号 |
H01L21/52;H01L21/58;H01L21/60;H01L23/498;H05K7/02 |
主分类号 |
H01L21/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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