发明名称 HIGHLY CONDUCTIVE POLYOXYMETHYLENE RESIN MOLDING
摘要 PURPOSE:To obtain a molding having excellent surface smoothness and contact electric resistance by molding a resin composition prepared by mixing a polyoxymethylene resin with specified carbon black, an epoxy compound and a specified polyester copolymer in a specified ratio. CONSTITUTION:A resin composition containing at least 55wt.% polyoxymethylene resin, 5-15wt.% carbon black having a dibutyl phthalate absorption of 300ml/100g or above, 0.05-10wt.% epoxy compound and 5-20wt.% copolymer of ethylene with a 3-6C alpha-olefin or polyester comprising at least one alcohol component selected from among 2-12C aliphatic diols with an acid component containing at least 20mol% at least one member selected from among 4-8C aliphatic dicarboxylic acids is molded to obtain a carbon black-filled polyoxymethylene resin molding having a volume resistance of 200OMEGA.cm or below, a centerline surface roughness of 10mum or below and a contact electric resistance of 1000OMEGA.cm. or below.
申请公布号 JPH03296557(A) 申请公布日期 1991.12.27
申请号 JP19900097547 申请日期 1990.04.16
申请人 ASAHI CHEM IND CO LTD 发明人 NIINO MASAHIKO;KUDO SHUICHI
分类号 C08J5/00;C08K3/04;C08K5/1515;C08L23/02;C08L59/00;C08L67/02;H01B1/24 主分类号 C08J5/00
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