Method and apparatus for packaging a semiconductor device.
摘要
<p>There is disclosed a method and an apparatus for packaging a semiconductor flip chip (1) in a substrate (3) by face-down bonding in which a coherent light is irradiated to a bonding head (2) and the substrate and the light reflected by the bonding head and the substrate are interferenced with each other. The adjustment of the inclination of the bonding head (2) against the substrate (3) is performed by the observation of the interference fringe caused by the interference between the lights reflected by the bonding head (2) and the substrate (3). <IMAGE></p>
